Wang, C.; Wei, Y.-C.; Sung, H.-K.; Kumar, A.; Zhou, Z.-L.; Zou, D.-Q.; Jiang, C.-P.; Yan, G.-F.; Choi, J.-H.; Dhakal, R.
Wafer-Scale Fabrication and Assembly Method of Multichannel Microelectrode Arrays for ECoG Application. Electronics 2021, 10, 316.
https://doi.org/10.3390/electronics10030316
AMA Style
Wang C, Wei Y-C, Sung H-K, Kumar A, Zhou Z-L, Zou D-Q, Jiang C-P, Yan G-F, Choi J-H, Dhakal R.
Wafer-Scale Fabrication and Assembly Method of Multichannel Microelectrode Arrays for ECoG Application. Electronics. 2021; 10(3):316.
https://doi.org/10.3390/electronics10030316
Chicago/Turabian Style
Wang, Cong, Yu-Chen Wei, Ho-Kun Sung, Alok Kumar, Zhong-Liang Zhou, Dan-Qing Zou, Cheng-Peng Jiang, Guo-Feng Yan, Jee-Hyun Choi, and Rajendra Dhakal.
2021. "Wafer-Scale Fabrication and Assembly Method of Multichannel Microelectrode Arrays for ECoG Application" Electronics 10, no. 3: 316.
https://doi.org/10.3390/electronics10030316
APA Style
Wang, C., Wei, Y.-C., Sung, H.-K., Kumar, A., Zhou, Z.-L., Zou, D.-Q., Jiang, C.-P., Yan, G.-F., Choi, J.-H., & Dhakal, R.
(2021). Wafer-Scale Fabrication and Assembly Method of Multichannel Microelectrode Arrays for ECoG Application. Electronics, 10(3), 316.
https://doi.org/10.3390/electronics10030316
