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Journal: Electronics, 2021
Volume: 10
Number: 194
Article:
A Study on the Effect of Bond Wires Lift-Off on IGBT Thermal Resistance Measurement
Authors:
by
Dan Luo, Minyou Chen, Wei Lai, Hongjian Xia, Xueni Ding and Zhenyu Deng
Link:
https://www.mdpi.com/2079-9292/10/2/194
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