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Article

Life-Cycle Expectation Using Fault-Tree Analysis for Improved Hybrid Submodule in HVDC System

1
Department of Electronics and Control Engineering, Hanbat National University, Daejeon 34158, Korea
2
Energy Conversion Research Centre, Korea Electronics Technology Institute, Gwangju 61011, Korea
*
Author to whom correspondence should be addressed.
Electronics 2021, 10(2), 133; https://doi.org/10.3390/electronics10020133
Received: 30 November 2020 / Revised: 20 December 2020 / Accepted: 7 January 2021 / Published: 9 January 2021
An improved hybrid submodule employs a direct current (DC) short current protection function to improve the reliability of a high-voltage direct current (HVDC) system. However, it increases the number of circuit components to implement the protection. So, we need to evaluate the relationship between the protection function and the increased number of circuit components to assess whether the improved hybrid submodule (IHSM) is suitable to practical application or not from the viewpoint of reliability. Although conventional part count failure analysis considers the type and the number of parts, it cannot reflect the operational characteristics of the submodule. To overcome this problem, we design a fault tree that reflects the operational characteristics of IHSM and calculates the failure rate by using MIL-HDBK-217F. By part count failure analysis (PCA) and fault-tree analysis (FTA), we prove the high reliability of IHSM compared to half-bridge, full-bridge, and clamped-double submodules. View Full-Text
Keywords: clamped-double submodule (CDSM); fault-tree analysis (FTA); full-bridge submodule (FBSM); half-bridge submodule (HBSM); high voltage direct current (HVDC) system; improved hybrid submodule (IHSM); mean time between failures (MTBF); part count failure analysis (PCA) clamped-double submodule (CDSM); fault-tree analysis (FTA); full-bridge submodule (FBSM); half-bridge submodule (HBSM); high voltage direct current (HVDC) system; improved hybrid submodule (IHSM); mean time between failures (MTBF); part count failure analysis (PCA)
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MDPI and ACS Style

Kang, F.-S.; Song, S.-G. Life-Cycle Expectation Using Fault-Tree Analysis for Improved Hybrid Submodule in HVDC System. Electronics 2021, 10, 133. https://doi.org/10.3390/electronics10020133

AMA Style

Kang F-S, Song S-G. Life-Cycle Expectation Using Fault-Tree Analysis for Improved Hybrid Submodule in HVDC System. Electronics. 2021; 10(2):133. https://doi.org/10.3390/electronics10020133

Chicago/Turabian Style

Kang, Feel-Soon, and Sung-Geun Song. 2021. "Life-Cycle Expectation Using Fault-Tree Analysis for Improved Hybrid Submodule in HVDC System" Electronics 10, no. 2: 133. https://doi.org/10.3390/electronics10020133

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