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Journal: Electronics, 2021
Volume: 10
Number: 2240
Article:
Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration
Authors:
by
Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao, Jiangtao Su, Bin You and Jun Liu
Link:
https://www.mdpi.com/2079-9292/10/18/2240
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