Next Article in Journal
A Proposal of Vertical MOSFET and Electrothermal Analysis for Monolithic 3-D ICs
Previous Article in Journal
Federated-Access Management System and Videoconferencing Applications: Results from a Pilot Service during COVID-19 Pandemic
 
 

Order Article Reprints

Journal: Electronics, 2021
Volume: 10
Number: 2240

Article: Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration
Authors: by Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao, Jiangtao Su, Bin You and Jun Liu
Link: https://www.mdpi.com/2079-9292/10/18/2240

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop