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Journal: Electronics, 2021
Volume: 10
Number: 1445
Article:
DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball
Authors:
by
Muhammad Waqar, Geunyong Bak, Junhyeong Kwon and Sanghyeon Baeg
Link:
https://www.mdpi.com/2079-9292/10/12/1445
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