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Journal: Electronics, 2021
Volume: 10
Number: 1445

Article: DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball
Authors: by Muhammad Waqar, Geunyong Bak, Junhyeong Kwon and Sanghyeon Baeg
Link: https://www.mdpi.com/2079-9292/10/12/1445

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