Chen, P.-C.; Chang, S.-M.; Kuo, H.-C.; Chang, F.-C.; Li, Y.-A.; Ting, C.-C.
Reliability Enhancement of 14 nm HPC ASIC Using Al2O3 Thin Film Coated with Room-Temperature Atomic Layer Deposition. Coatings 2022, 12, 1308.
https://doi.org/10.3390/coatings12091308
AMA Style
Chen P-C, Chang S-M, Kuo H-C, Chang F-C, Li Y-A, Ting C-C.
Reliability Enhancement of 14 nm HPC ASIC Using Al2O3 Thin Film Coated with Room-Temperature Atomic Layer Deposition. Coatings. 2022; 12(9):1308.
https://doi.org/10.3390/coatings12091308
Chicago/Turabian Style
Chen, Po-Chou, Shu-Mei Chang, Hao-Chung Kuo, Fu-Cheng Chang, Yu-An Li, and Chao-Cheng Ting.
2022. "Reliability Enhancement of 14 nm HPC ASIC Using Al2O3 Thin Film Coated with Room-Temperature Atomic Layer Deposition" Coatings 12, no. 9: 1308.
https://doi.org/10.3390/coatings12091308
APA Style
Chen, P.-C., Chang, S.-M., Kuo, H.-C., Chang, F.-C., Li, Y.-A., & Ting, C.-C.
(2022). Reliability Enhancement of 14 nm HPC ASIC Using Al2O3 Thin Film Coated with Room-Temperature Atomic Layer Deposition. Coatings, 12(9), 1308.
https://doi.org/10.3390/coatings12091308