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Journal: Coatings, 2021
Volume: 11
Number: 935
935
Article: Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints
Authors: by Noor Zaimah Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Jitrin Chaiprapa, Petrica Vizureanu and Mohd Izrul Izwan Ramli
Link: https://www.mdpi.com/2079-6412/11/8/935

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