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Multi-Scale Modeling and Simulation of Thermoplastic Automated Tape Placement: Effects of Metallic Particles Reinforcement on Part Consolidation

1
ESI Group, 3bis rue Saarinen, 94528 Rungis CEDEX, France
2
GeM, Ecole Centrale Nantes, 1 rue de la Noe, 44300 Nantes, France
3
I2M, ENSAM ParisTech, Esplanade des Arts et Métiers, 33405 Talence CEDEX, France
4
ArianeGroup, Rue du Général Niox, BP30056, 33166 Saint-Médard-en-Jalles, France
5
PIMM Lab & ESI Group Chair, ENSAM Paristech, 151 Boulevard de l’Hôpital, 75013 Paris, France
*
Author to whom correspondence should be addressed.
Nanomaterials 2019, 9(5), 695; https://doi.org/10.3390/nano9050695
Received: 17 March 2019 / Revised: 21 April 2019 / Accepted: 22 April 2019 / Published: 4 May 2019
(This article belongs to the Special Issue Processing of Thermoplastic-Matrix Polymer Nanocomposites)
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Abstract

This paper concerns engineered composites integrating metallic particles to enhance thermal and electrical properties. However, these properties are strongly dependent on the forming process itself that determines the particle distribution and orientation. At the same time, the resulting enhanced thermal properties affect the reinforced resin viscosity whose flow is involved in the intimate contact evolution. Thus, a subtle and intricate coupling appears, and the process cannot be defined by ignoring it. In this paper, we analyze the effects of particle concentration and orientation on the process and processability. For this purpose, three main models are combined: (i) a multi-scale surface representation and its evolution, by using an appropriate numerical model; (ii) flow-induced orientation, and (iii) the impact of the orientation state on the homogenized thermal conductivity. View Full-Text
Keywords: reinforced resins; microwires; consolidation; prepreg; squeeze flow; PGD; wavelet surface representation reinforced resins; microwires; consolidation; prepreg; squeeze flow; PGD; wavelet surface representation
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Leon, A.; Perez, M.; Barasinski, A.; Abisset-Chavanne, E.; Defoort, B.; Chinesta, F. Multi-Scale Modeling and Simulation of Thermoplastic Automated Tape Placement: Effects of Metallic Particles Reinforcement on Part Consolidation. Nanomaterials 2019, 9, 695.

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