Chen, X.;                     Fu, X.;                     Chen, Z.;                     Zhai, Z.;                     Miu, H.;                     Tao, P.    
        Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering. Nanomaterials 2025, 15, 1148.
    https://doi.org/10.3390/nano15151148
    AMA Style
    
                                Chen X,                                 Fu X,                                 Chen Z,                                 Zhai Z,                                 Miu H,                                 Tao P.        
                Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering. Nanomaterials. 2025; 15(15):1148.
        https://doi.org/10.3390/nano15151148
    
    Chicago/Turabian Style
    
                                Chen, Xi,                                 Xin Fu,                                 Zhansheng Chen,                                 Zaiteng Zhai,                                 Hongkang Miu,                                 and Peng Tao.        
                2025. "Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering" Nanomaterials 15, no. 15: 1148.
        https://doi.org/10.3390/nano15151148
    
    APA Style
    
                                Chen, X.,                                 Fu, X.,                                 Chen, Z.,                                 Zhai, Z.,                                 Miu, H.,                                 & Tao, P.        
        
        (2025). Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering. Nanomaterials, 15(15), 1148.
        https://doi.org/10.3390/nano15151148