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Journal: Nanomaterials, 2023
Volume: 13
Number: 709

Article: Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing
Authors: by Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu and Chih Chen
Link: https://www.mdpi.com/2079-4991/13/4/709

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