Doddapaneni, V.V.K.; Lee, K.; Aysal, H.E.; Paul, B.K.; Pasebani, S.; Sierros, K.A.; Okwudire, C.E.; Chang, C.-h.
A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten. Nanomaterials 2023, 13, 2303.
https://doi.org/10.3390/nano13162303
AMA Style
Doddapaneni VVK, Lee K, Aysal HE, Paul BK, Pasebani S, Sierros KA, Okwudire CE, Chang C-h.
A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten. Nanomaterials. 2023; 13(16):2303.
https://doi.org/10.3390/nano13162303
Chicago/Turabian Style
Doddapaneni, V. Vinay K., Kijoon Lee, Havva Eda Aysal, Brian K. Paul, Somayeh Pasebani, Konstantinos A. Sierros, Chinedum E. Okwudire, and Chih-hung Chang.
2023. "A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten" Nanomaterials 13, no. 16: 2303.
https://doi.org/10.3390/nano13162303
APA Style
Doddapaneni, V. V. K., Lee, K., Aysal, H. E., Paul, B. K., Pasebani, S., Sierros, K. A., Okwudire, C. E., & Chang, C.-h.
(2023). A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten. Nanomaterials, 13(16), 2303.
https://doi.org/10.3390/nano13162303