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Article

Computational Study on Surface Bonding Based on Nanocone Arrays

by 1,2, 2 and 1,*
1
School of Mechanical Engineering, Zhengzhou University, Zhengzhou 450001, China
2
Institute of Applied Physics, Henan Academy of Sciences, Zhengzhou 450008, China
*
Author to whom correspondence should be addressed.
Academic Editor: Francisco Torrens
Nanomaterials 2021, 11(6), 1369; https://doi.org/10.3390/nano11061369
Received: 22 April 2021 / Revised: 18 May 2021 / Accepted: 19 May 2021 / Published: 21 May 2021
(This article belongs to the Special Issue Advanced Mechanical Modeling of Nanomaterials and Nanostructures)
Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance. View Full-Text
Keywords: surface bonding; nanocone arrays; molecular dynamics simulation surface bonding; nanocone arrays; molecular dynamics simulation
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MDPI and ACS Style

Song, X.; Wu, S.; Zhang, R. Computational Study on Surface Bonding Based on Nanocone Arrays. Nanomaterials 2021, 11, 1369. https://doi.org/10.3390/nano11061369

AMA Style

Song X, Wu S, Zhang R. Computational Study on Surface Bonding Based on Nanocone Arrays. Nanomaterials. 2021; 11(6):1369. https://doi.org/10.3390/nano11061369

Chicago/Turabian Style

Song, Xiaohui, Shunli Wu, and Rui Zhang. 2021. "Computational Study on Surface Bonding Based on Nanocone Arrays" Nanomaterials 11, no. 6: 1369. https://doi.org/10.3390/nano11061369

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