Next Article in Journal
Computational Study of Quenching Effects on Growth Processes and Size Distributions of Silicon Nanoparticles at a Thermal Plasma Tail
Next Article in Special Issue
Nonlocal Analysis of the Flexural–Torsional Stability for FG Tapered Thin-Walled Beam-Columns
Previous Article in Journal
Thin Films of Metal-Organic Framework Interfaces Obtained by Laser Evaporation
Previous Article in Special Issue
Molecular Dynamics Simulation for the Effect of Fluorinated Graphene Oxide Layer Spacing on the Thermal and Mechanical Properties of Fluorinated Epoxy Resin

Computational Study on Surface Bonding Based on Nanocone Arrays

by 1,2, 2 and 1,*
School of Mechanical Engineering, Zhengzhou University, Zhengzhou 450001, China
Institute of Applied Physics, Henan Academy of Sciences, Zhengzhou 450008, China
Author to whom correspondence should be addressed.
Academic Editor: Francisco Torrens
Nanomaterials 2021, 11(6), 1369;
Received: 22 April 2021 / Revised: 18 May 2021 / Accepted: 19 May 2021 / Published: 21 May 2021
(This article belongs to the Special Issue Advanced Mechanical Modeling of Nanomaterials and Nanostructures)
Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance. View Full-Text
Keywords: surface bonding; nanocone arrays; molecular dynamics simulation surface bonding; nanocone arrays; molecular dynamics simulation
Show Figures

Figure 1

MDPI and ACS Style

Song, X.; Wu, S.; Zhang, R. Computational Study on Surface Bonding Based on Nanocone Arrays. Nanomaterials 2021, 11, 1369.

AMA Style

Song X, Wu S, Zhang R. Computational Study on Surface Bonding Based on Nanocone Arrays. Nanomaterials. 2021; 11(6):1369.

Chicago/Turabian Style

Song, Xiaohui, Shunli Wu, and Rui Zhang. 2021. "Computational Study on Surface Bonding Based on Nanocone Arrays" Nanomaterials 11, no. 6: 1369.

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

Back to TopTop