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Journal: Nanomaterials, 2021
Volume: 11
Number: 2554
2554
Article: Integration Technology for Wafer-Level LiNbO₃ Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing
Authors: by Wenping Geng, Xiangyu Yang, Gang Xue, Wenhao Xu, Kaixi Bi, Linyu Mei, Le Zhang, Xiaojuan Hou and Xiujian Chou
Link: https://www.mdpi.com/2079-4991/11/10/2554

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