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Open AccessArticle

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

1
NTNU Nanomechanical Lab, Department of Structural Engineering, Norwegian University of Science and Technology (NTNU), 7491 Trondheim, Norway
2
Catalan Institute of Nanoscience and Nanotechnology (ICN2), (ICN-CSIC) Barcelona, Campus UAB, E08193 Bellaterra, Spain
3
ICREA—Institució Catalana de Recerca i Estudis Avançats, 08010 Barcelona, Spain
*
Author to whom correspondence should be addressed.
Nanomaterials 2020, 10(4), 670; https://doi.org/10.3390/nano10040670
Received: 9 March 2020 / Revised: 26 March 2020 / Accepted: 31 March 2020 / Published: 2 April 2020
(This article belongs to the Special Issue Thermal Transport in Nanostructures and Nanomaterials)
In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic–inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal–polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1–15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal—either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal–polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m−2·K−1 to 115 × 106 W·m−2·K−1, while the nickel layer increased TBC to 139 × 106 W·m−2·K−1. These results shed light on possible strategies to improve heat transport in organic electronic systems. View Full-Text
Keywords: enhancement of thermal boundary conductance; thermal conductivity of polymer thin films; organic electronics; thermal characterization of polymer; adhesion layer enhancement of thermal boundary conductance; thermal conductivity of polymer thin films; organic electronics; thermal characterization of polymer; adhesion layer
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MDPI and ACS Style

Sandell, S.; Maire, J.; Chávez-Ángel, E.; Sotomayor Torres, C.M.; Kristiansen, H.; Zhang, Z.; He, J. Enhancement of Thermal Boundary Conductance of Metal–Polymer System. Nanomaterials 2020, 10, 670.

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