Life Cycle Assessment of a Virtual Reality Device
Abstract
:1. Introduction
1.1. Review of Prior Knowledge Observations
1.2. Objectives
2. Materials and Methods—Screening Life Cycle Assessment Using Single Weighted Scores
2.1. Methodology
2.2. Description of the VR Device Product and Life Cycle
2.2.1. Functional Unit
2.2.2 System Boundaries
Pre-Final Assembly—Raw Material Acquisition, Part Production, and Final Assembly
Final Assembly (FA)
Distribution
Use
End-of-Life Treatment (EoLT)
3. Results
4. Discussion
4.1. ILCD Evaluations
4.2. Applying the Weighting Methods EPS2015 and LIME2 as a Sensitivity Check of ILCD
4.3. EPS2015 Evaluations
4.4. LIME2 Evaluations
5. Conclusions
6. Next Steps
Acknowledgments
Conflicts of Interest
References
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Scenario 1—Baseline | Scenario 2 | Scenario 3 | Scenario 4 |
---|---|---|---|
Only use ore mining of metals | Only use secondary metals (Au, Ag, Cu) | Ore mining of metals | Ore mining of metals |
High Impact Electric Power (HIEP) for wafer processing (WP), Integrated Circuit (IC) assembly and Printed Circuit Board (PCB) assembly (WP and IC and PCB) | HIEP for WP and IC and PCB | HIEP for WP and IC and PCB | Low Impact Electric Power (LIEP) for WP and IC and PCB |
HIEP for final assembly (FA) | HIEP for FA | HIEP for FA | LIEP for FA |
Airplane distribution | Airplane distribution | Airplane distribution | Airplane distribution |
European average impact electric power (EAIEP) for Use | EAIEP for Use | EAIEP for Use | EAIEP for Use |
No reuse | No reuse | 5% reuse of entire product | No reuse |
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Andrae, A.S.G. Life Cycle Assessment of a Virtual Reality Device. Challenges 2017, 8, 15. https://doi.org/10.3390/challe8020015
Andrae ASG. Life Cycle Assessment of a Virtual Reality Device. Challenges. 2017; 8(2):15. https://doi.org/10.3390/challe8020015
Chicago/Turabian StyleAndrae, Anders S. G. 2017. "Life Cycle Assessment of a Virtual Reality Device" Challenges 8, no. 2: 15. https://doi.org/10.3390/challe8020015
APA StyleAndrae, A. S. G. (2017). Life Cycle Assessment of a Virtual Reality Device. Challenges, 8(2), 15. https://doi.org/10.3390/challe8020015