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Volume 13
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10.3390/jmse13101867
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This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Article

Numerical Analysis of Thermal–Structural Coupling for Subsea Dual-Channel Connector

by
Feihong Yun
1,
Yuming Du
1,
Dong Liu
2,
Xiaofei Wu
3,
Minggang Tang
3,
Qiuying Yan
4,*,
Peng Gao
1,
Yu Chen
1,
Xu Zhai
3,
Hanyu Sun
3,
Songlin Zhang
3,
Shuqi Lin
1 and
Haiyang Xu
1
1
College of Mechanical and Electrical Engineering, Harbin Engineering University, Harbin 150001, China
2
Shanghai Marine Equipment Research Institute, Shanghai 200031, China
3
China Ship Scientific Research Center, Wuxi 214028, China
4
China Academy of Aerospace Aero-Propulsion Technology, Xiangyang 441003, China
*
Author to whom correspondence should be addressed.
J. Mar. Sci. Eng. 2025, 13(10), 1867; https://doi.org/10.3390/jmse13101867
Submission received: 27 August 2025 / Revised: 23 September 2025 / Accepted: 25 September 2025 / Published: 26 September 2025
(This article belongs to the Section Ocean Engineering)
Versions Notes

Abstract

In deep-sea oil and gas development scenarios, deep-sea dual-channel connectors often face the risk of seal failure due to internal and external temperature difference loads. To address this issue, this paper systematically establishes equivalent heat transfer models for the key parts of the connector based on the third-type boundary condition. On this basis, the quantitative correlation between the equivalent thermal conductivity, composite heat transfer coefficient and temperature of each part is explored. Using the finite element numerical simulation method, the transient temperature field of the connector under three working conditions (heating, cooling and temperature shock) is simulated and analyzed, revealing the temperature distribution characteristics and temperature change trends of the maximum temperature difference of each key component of the connector; combined with thermal–structural coupling simulation, the temperature field is converted into static load, to determine the behavior of the contact stress on the sealing surface under different temperature–pressure coupling working conditions; in addition, by placing the test prototype in a high-low temperature cycle chamber, the seal performance tests under pressurized and non-pressurized working conditions are carried out to verify the reliable sealing performance of the connector under variable temperature conditions. The results of this paper provide comprehensive theoretical support and an experimental basis for the thermodynamic optimization design of deep-sea connectors and the improvement of the reliability of the sealing system.
Keywords: thermal–structural coupling; thermal conductivity; sealing; temperature field thermal–structural coupling; thermal conductivity; sealing; temperature field

Share and Cite

MDPI and ACS Style

Yun, F.; Du, Y.; Liu, D.; Wu, X.; Tang, M.; Yan, Q.; Gao, P.; Chen, Y.; Zhai, X.; Sun, H.; et al. Numerical Analysis of Thermal–Structural Coupling for Subsea Dual-Channel Connector. J. Mar. Sci. Eng. 2025, 13, 1867. https://doi.org/10.3390/jmse13101867

AMA Style

Yun F, Du Y, Liu D, Wu X, Tang M, Yan Q, Gao P, Chen Y, Zhai X, Sun H, et al. Numerical Analysis of Thermal–Structural Coupling for Subsea Dual-Channel Connector. Journal of Marine Science and Engineering. 2025; 13(10):1867. https://doi.org/10.3390/jmse13101867

Chicago/Turabian Style

Yun, Feihong, Yuming Du, Dong Liu, Xiaofei Wu, Minggang Tang, Qiuying Yan, Peng Gao, Yu Chen, Xu Zhai, Hanyu Sun, and et al. 2025. "Numerical Analysis of Thermal–Structural Coupling for Subsea Dual-Channel Connector" Journal of Marine Science and Engineering 13, no. 10: 1867. https://doi.org/10.3390/jmse13101867

APA Style

Yun, F., Du, Y., Liu, D., Wu, X., Tang, M., Yan, Q., Gao, P., Chen, Y., Zhai, X., Sun, H., Zhang, S., Lin, S., & Xu, H. (2025). Numerical Analysis of Thermal–Structural Coupling for Subsea Dual-Channel Connector. Journal of Marine Science and Engineering, 13(10), 1867. https://doi.org/10.3390/jmse13101867

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