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InP-Based Foundry PICs for Optical Interconnects

Fraunhofer Heinrich Hertz Institute, 10587 Berlin, Germany
Author to whom correspondence should be addressed.
Appl. Sci. 2019, 9(8), 1588;
Received: 25 February 2019 / Revised: 9 April 2019 / Accepted: 9 April 2019 / Published: 17 April 2019
(This article belongs to the Special Issue PICs for Optical Interconnects)
This paper describes a fabrication process for realizing Indium-Phosphide-based photonic-integrated circuits (PICs) with a high level of integration to target a wide variety of optical applications. To show the diversity in PICs achievable with our open-access foundry process, we illustrate two examples: a fully-integrated 20 Gb/s dual-polarization electro-absorption-modulated laser, and a balanced detector composed of avalanche photodiodes for detection of 28 Gb/s optical signals. On another note, datacenters are increasingly relying on hybrid integration of PICs from different technology platforms to increase transmission capacity, while simultaneously lowering cost, size, and power consumption. Several technology platforms require surface coupling rather than the traditional edge coupling to couple the light from one PIC to another. To accommodate the surface-coupling approach in our integration platform, we have developed a strategy to transfer the following optical Input/Output devices into our fabrication process: grating couplers, and vertical mirrors. In addition, we introduced etched facets into the process to improve the usability of our edge-coupling elements. We believe that the additional flexibility in Input/Output interfacing combined with the integration of multiple devices onto one PIC to reduce the number of PIC-to-PIC alignments can contribute significantly to the development of compact, low-cost, and high-performance datacenter modules. View Full-Text
Keywords: photonic integrated circuits; indium phosphide semiconductors; optical interconnects photonic integrated circuits; indium phosphide semiconductors; optical interconnects
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MDPI and ACS Style

Soares, F.M.; Baier, M.; Gaertner, T.; Grote, N.; Moehrle, M.; Beckerwerth, T.; Runge, P.; Schell, M. InP-Based Foundry PICs for Optical Interconnects. Appl. Sci. 2019, 9, 1588.

AMA Style

Soares FM, Baier M, Gaertner T, Grote N, Moehrle M, Beckerwerth T, Runge P, Schell M. InP-Based Foundry PICs for Optical Interconnects. Applied Sciences. 2019; 9(8):1588.

Chicago/Turabian Style

Soares, Francisco M., Moritz Baier, Tom Gaertner, Norbert Grote, Martin Moehrle, Tobias Beckerwerth, Patrick Runge, and Martin Schell. 2019. "InP-Based Foundry PICs for Optical Interconnects" Applied Sciences 9, no. 8: 1588.

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