Next Article in Journal
Smart Obstacle Avoidance Using a Danger Index for a Dynamic Environment
Next Article in Special Issue
Automatic Initialization Methods for Photonic Components on a Silicon-Based Optical Switch
Previous Article in Journal
High Voltage Graphene Nanowall Trench MOS Barrier Schottky Diode Characterization for High Temperature Applications
Previous Article in Special Issue
Generalization of an Optical ASA Switch
Article Menu
Issue 8 (April-2) cover image

Export Article

Open AccessFeature PaperArticle

InP-Based Foundry PICs for Optical Interconnects

Fraunhofer Heinrich Hertz Institute, 10587 Berlin, Germany
*
Author to whom correspondence should be addressed.
Appl. Sci. 2019, 9(8), 1588; https://doi.org/10.3390/app9081588
Received: 25 February 2019 / Revised: 9 April 2019 / Accepted: 9 April 2019 / Published: 17 April 2019
(This article belongs to the Special Issue PICs for Optical Interconnects)
  |  
PDF [4062 KB, uploaded 17 April 2019]
  |  

Abstract

This paper describes a fabrication process for realizing Indium-Phosphide-based photonic-integrated circuits (PICs) with a high level of integration to target a wide variety of optical applications. To show the diversity in PICs achievable with our open-access foundry process, we illustrate two examples: a fully-integrated 20 Gb/s dual-polarization electro-absorption-modulated laser, and a balanced detector composed of avalanche photodiodes for detection of 28 Gb/s optical signals. On another note, datacenters are increasingly relying on hybrid integration of PICs from different technology platforms to increase transmission capacity, while simultaneously lowering cost, size, and power consumption. Several technology platforms require surface coupling rather than the traditional edge coupling to couple the light from one PIC to another. To accommodate the surface-coupling approach in our integration platform, we have developed a strategy to transfer the following optical Input/Output devices into our fabrication process: grating couplers, and vertical mirrors. In addition, we introduced etched facets into the process to improve the usability of our edge-coupling elements. We believe that the additional flexibility in Input/Output interfacing combined with the integration of multiple devices onto one PIC to reduce the number of PIC-to-PIC alignments can contribute significantly to the development of compact, low-cost, and high-performance datacenter modules. View Full-Text
Keywords: photonic integrated circuits; indium phosphide semiconductors; optical interconnects photonic integrated circuits; indium phosphide semiconductors; optical interconnects
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Soares, F.M.; Baier, M.; Gaertner, T.; Grote, N.; Moehrle, M.; Beckerwerth, T.; Runge, P.; Schell, M. InP-Based Foundry PICs for Optical Interconnects. Appl. Sci. 2019, 9, 1588.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Appl. Sci. EISSN 2076-3417 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top