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Journal: Appl. Sci., 2019
Volume: 9
Number: 1155
Article:
Resilient Modulus—Physical Parameters Relationship of Improved Red Clay by Dynamic Tri-Axial Test
Authors:
by
Haiping Yuan, Weiqiang Li, Yixian Wang, Hang Lin and Yan Liu
Link:
https://www.mdpi.com/2076-3417/9/6/1155
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