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Journal: Appl. Sci., 2019
Volume: 9
Number: 3590

Article: Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
Authors: by Jie Wu, Songbai Xue, Jingwen Wang and Guoqiang Huang
Link: https://www.mdpi.com/2076-3417/9/17/3590

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