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Journal: Appl. Sci., 2019
Volume: 9
Number: 3476
Article:
Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach
Authors:
by
Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba and Akio Hirose
Link:
https://www.mdpi.com/2076-3417/9/17/3476
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