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Journal: Appl. Sci., 2018
Volume: 8
Number: 367

Article: Polyimide Encapsulation of Spider-Inspired Crack-Based Sensors for Durability Improvement
Authors: by Taewi Kim, Taemin Lee, Gunhee Lee, Yong Whan Choi, Sang Moon Kim, Daeshik Kang and Mansoo Choi
Link: https://www.mdpi.com/2076-3417/8/3/367

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