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Journal: Appl. Sci., 2018
Volume: 8
Number: 2703

Article: Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems
Authors: by Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
Link: https://www.mdpi.com/2076-3417/8/12/2703

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