Next Article in Journal
Energy-Efficient Optimization Design for the Multi-Color LED Based Visible Light Communication Systems under Illumination Constraints
Next Article in Special Issue
Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging
Previous Article in Journal
Resistance of L. monocytogenes and S. Typhimurium towards Cold Atmospheric Plasma as Function of Biofilm Age
Previous Article in Special Issue
The Effect of Interfacial Ge and RF-Bias on the Microstructure and Stress Evolution upon Annealing of Ag/AlN Multilayers
 
 

Order Article Reprints

Journal: Appl. Sci., 2018
Volume: 8
Number: 2703

Article: Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems
Authors: by Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
Link: https://www.mdpi.com/2076-3417/8/12/2703

MDPI provides article reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.

If you have any questions, or special requests, please write to our support team; we are happy to provide you with the information you need.

Reprint Options

If you need more than 400 copies, please contact us by e-mail (publisher@mdpi.com) and we will prepare an individual offer for you.

Order Cost and Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop