Peng, J.; Lu, K.; Hu, S.; Fang, Z.; Ning, H.; Wei, J.; Zhu, Z.; Zhou, Y.; Wang, L.; Yao, R.;
et al. High Conductivity and Adhesion of Cu-Cr-Zr Alloy for TFT Gate Electrode. Appl. Sci. 2017, 7, 820.
https://doi.org/10.3390/app7080820
AMA Style
Peng J, Lu K, Hu S, Fang Z, Ning H, Wei J, Zhu Z, Zhou Y, Wang L, Yao R,
et al. High Conductivity and Adhesion of Cu-Cr-Zr Alloy for TFT Gate Electrode. Applied Sciences. 2017; 7(8):820.
https://doi.org/10.3390/app7080820
Chicago/Turabian Style
Peng, Junbiao, Kuankuan Lu, Shiben Hu, Zhiqiang Fang, Honglong Ning, Jinglin Wei, Zhennan Zhu, Yicong Zhou, Lei Wang, Rihui Yao,
and et al. 2017. "High Conductivity and Adhesion of Cu-Cr-Zr Alloy for TFT Gate Electrode" Applied Sciences 7, no. 8: 820.
https://doi.org/10.3390/app7080820
APA Style
Peng, J., Lu, K., Hu, S., Fang, Z., Ning, H., Wei, J., Zhu, Z., Zhou, Y., Wang, L., Yao, R., & Lu, X.
(2017). High Conductivity and Adhesion of Cu-Cr-Zr Alloy for TFT Gate Electrode. Applied Sciences, 7(8), 820.
https://doi.org/10.3390/app7080820