Zhang, Y.; Liu, J.; Mu, C.; Qiao, Z.; Fan, M.; Liu, C.
The Comparative Behavior of Undisturbed Soft Clay Results Based on Photogrammetry and Numerical Simulation. Appl. Sci. 2025, 15, 4752.
https://doi.org/10.3390/app15094752
AMA Style
Zhang Y, Liu J, Mu C, Qiao Z, Fan M, Liu C.
The Comparative Behavior of Undisturbed Soft Clay Results Based on Photogrammetry and Numerical Simulation. Applied Sciences. 2025; 15(9):4752.
https://doi.org/10.3390/app15094752
Chicago/Turabian Style
Zhang, Yi, Jungang Liu, Chunmei Mu, Zhibo Qiao, Mingliang Fan, and Chunfan Liu.
2025. "The Comparative Behavior of Undisturbed Soft Clay Results Based on Photogrammetry and Numerical Simulation" Applied Sciences 15, no. 9: 4752.
https://doi.org/10.3390/app15094752
APA Style
Zhang, Y., Liu, J., Mu, C., Qiao, Z., Fan, M., & Liu, C.
(2025). The Comparative Behavior of Undisturbed Soft Clay Results Based on Photogrammetry and Numerical Simulation. Applied Sciences, 15(9), 4752.
https://doi.org/10.3390/app15094752