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Volume 15
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10.3390/app15105670
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This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Article

Analytical Modeling of Particle Scratching Process

by
Shouhong Chen
1,
Mingjun Sun
2,3,4,
Yuantao Fan
2,4,
Fangchen Yin
2,3,4,
Jixiang Huang
2,3,4 and
Shengui Huang
2,3,4,*
1
College of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, China
2
Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021, China
3
National and Local Joint Engineering Research Center for Intelligent Manufacturing Technology of Brittle Material Products, Xiamen 361021, China
4
Nan’an-HQU Institute of Stone Industry Innovations Technology, Quanzhou 362261, China
*
Author to whom correspondence should be addressed.
Appl. Sci. 2025, 15(10), 5670; https://doi.org/10.3390/app15105670
Submission received: 21 February 2025 / Revised: 9 May 2025 / Accepted: 13 May 2025 / Published: 19 May 2025
Versions Notes

Abstract

This study develops a new physical and analytical model for the particle scratching process, where a particle is modeled as a sphere. It investigates the flow of workpiece material introduced by the particle’s motion, dividing the contact area into zones of elastic and plastic deformation. Forces applied to the particle in both zones are calculated, and parameters defining the extent of elastic rebound and plastic upheaval are introduced. The study also presents stress distribution in the plastic zone, discusses the factors influencing the force ratio, and reveals that the force ratio increases with greater elastic rebound, plastic upheaval, cutting depth, and strain strengthening, but decreases with larger particle sizes. Yield stress was found to have no effect on the force ratio. These findings will guide research in practical material processing as well as in scratch applications.
Keywords: physical model; analytical model; stress distribution; force ratio physical model; analytical model; stress distribution; force ratio

Share and Cite

MDPI and ACS Style

Chen, S.; Sun, M.; Fan, Y.; Yin, F.; Huang, J.; Huang, S. Analytical Modeling of Particle Scratching Process. Appl. Sci. 2025, 15, 5670. https://doi.org/10.3390/app15105670

AMA Style

Chen S, Sun M, Fan Y, Yin F, Huang J, Huang S. Analytical Modeling of Particle Scratching Process. Applied Sciences. 2025; 15(10):5670. https://doi.org/10.3390/app15105670

Chicago/Turabian Style

Chen, Shouhong, Mingjun Sun, Yuantao Fan, Fangchen Yin, Jixiang Huang, and Shengui Huang. 2025. "Analytical Modeling of Particle Scratching Process" Applied Sciences 15, no. 10: 5670. https://doi.org/10.3390/app15105670

APA Style

Chen, S., Sun, M., Fan, Y., Yin, F., Huang, J., & Huang, S. (2025). Analytical Modeling of Particle Scratching Process. Applied Sciences, 15(10), 5670. https://doi.org/10.3390/app15105670

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