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Journal: Appl. Sci., 2023
Volume: 13
Number: 12137

Article: Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions
Authors: by Jae-Hyuk Lim, Da-Hun Lee and Eun-Ho Lee
Link: https://www.mdpi.com/2076-3417/13/22/12137

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