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Journal: Appl. Sci., 2022
Volume: 12
Number: 9778

Article: In Situ Annealing Behavior of Cu Thin Films Deposited over Co-W Diffusion Barrier Layers
Authors: by Bruno M. C. Oliveira, Ruben F. Santos and Manuel F. Vieira
Link: https://www.mdpi.com/2076-3417/12/19/9778

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