Lindner, M.; Pipa, A.V.; Karpen, N.; Hink, R.; Berndt, D.; Foest, R.; Bonaccurso, E.; Weichwald, R.; Friedberger, A.; Caspari, R.;
et al. Icing Mitigation by MEMS-Fabricated Surface Dielectric Barrier Discharge. Appl. Sci. 2021, 11, 11106.
https://doi.org/10.3390/app112311106
AMA Style
Lindner M, Pipa AV, Karpen N, Hink R, Berndt D, Foest R, Bonaccurso E, Weichwald R, Friedberger A, Caspari R,
et al. Icing Mitigation by MEMS-Fabricated Surface Dielectric Barrier Discharge. Applied Sciences. 2021; 11(23):11106.
https://doi.org/10.3390/app112311106
Chicago/Turabian Style
Lindner, Matthias, Andrei V. Pipa, Norbert Karpen, Rüdiger Hink, Dominik Berndt, Rüdiger Foest, Elmar Bonaccurso, Robert Weichwald, Alois Friedberger, Ralf Caspari,
and et al. 2021. "Icing Mitigation by MEMS-Fabricated Surface Dielectric Barrier Discharge" Applied Sciences 11, no. 23: 11106.
https://doi.org/10.3390/app112311106
APA Style
Lindner, M., Pipa, A. V., Karpen, N., Hink, R., Berndt, D., Foest, R., Bonaccurso, E., Weichwald, R., Friedberger, A., Caspari, R., Brandenburg, R., & Schreiner, R.
(2021). Icing Mitigation by MEMS-Fabricated Surface Dielectric Barrier Discharge. Applied Sciences, 11(23), 11106.
https://doi.org/10.3390/app112311106