Next Article in Journal
fNIRS-QC: Crowd-Sourced Creation of a Dataset and Machine Learning Model for fNIRS Quality Control
Previous Article in Journal
Keyword Detection Based on RetinaNet and Transfer Learning for Personal Information Protection in Document Images
Article

Chemical Bond Formation between Vertically Aligned Carbon Nanotubes and Metal Substrates at Low Temperatures

Department of Chemistry, University of Cincinnati, Cincinnati, OH 45221, USA
*
Author to whom correspondence should be addressed.
Academic Editor: Henrique Leonel Gomes
Appl. Sci. 2021, 11(20), 9529; https://doi.org/10.3390/app11209529
Received: 20 September 2021 / Revised: 2 October 2021 / Accepted: 6 October 2021 / Published: 14 October 2021
(This article belongs to the Special Issue Carbon Based Electronics: Recent Advances and Future Challenges)
The exceptional physical properties of carbon nanotubes (CNTs) have the potential to transform materials science and various industrial applications. However, to exploit their unique properties in carbon-based electronics, CNTs regularly need to be chemically interfaced with metals. Although CNTs can be directly synthesized on metal substrates, this process typically requires temperatures above 350 °C, which is not compatible for many applications. Additionally, the CNTs employed here were highly densified, making them suitable as interconnecting materials for electronic applications. This paper reports a method for the chemical bonding of vertically aligned CNTs onto metal substrates that avoids the need for high temperatures and can be performed at temperatures as low as 80 °C. Open-ended CNTs were directly bonded onto Cu and Pt substrates that had been functionalized using diazonium radical reactive species, thus allowing bond formation with the open-ended CNTs. Careful control during grafting of the organic species onto the metal substrates resulted in functional group uniformity, as demonstrated by FT-IR analysis. Scanning electron microscopy images confirmed the formation of direct connections between the vertically aligned CNTs and the metal substrates. Furthermore, electrochemical characterization and application as a sensor revealed the nature of the bonding between the CNTs and the metal substrates. View Full-Text
Keywords: carbon nanotubes; metal–carbon interface; bond formation carbon nanotubes; metal–carbon interface; bond formation
Show Figures

Figure 1

MDPI and ACS Style

Nawarathne, C.P.; Hoque, A.; Ruhunage, C.K.; Rahm, C.E.; Alvarez, N.T. Chemical Bond Formation between Vertically Aligned Carbon Nanotubes and Metal Substrates at Low Temperatures. Appl. Sci. 2021, 11, 9529. https://doi.org/10.3390/app11209529

AMA Style

Nawarathne CP, Hoque A, Ruhunage CK, Rahm CE, Alvarez NT. Chemical Bond Formation between Vertically Aligned Carbon Nanotubes and Metal Substrates at Low Temperatures. Applied Sciences. 2021; 11(20):9529. https://doi.org/10.3390/app11209529

Chicago/Turabian Style

Nawarathne, Chaminda P., Abdul Hoque, Chethani K. Ruhunage, Connor E. Rahm, and Noe T. Alvarez 2021. "Chemical Bond Formation between Vertically Aligned Carbon Nanotubes and Metal Substrates at Low Temperatures" Applied Sciences 11, no. 20: 9529. https://doi.org/10.3390/app11209529

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop