Article Versions Notes

Jiang H, Sa J, Fan C, Zhou Y, Gu H, Yang X, Su X, Zhang Z. Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature. Applied Sciences. 2021; 11(19):8844. https://doi.org/10.3390/app11198844

Jiang, He, Jiming Sa, Cong Fan, Yiwen Zhou, Hanwen Gu, Xuezhou Yang, Xiaofeng Su, and Zhushanying Zhang. 2021. "Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature" Applied Sciences 11, no. 19: 8844. https://doi.org/10.3390/app11198844

Jiang, H., Sa, J., Fan, C., Zhou, Y., Gu, H., Yang, X., Su, X., & Zhang, Z. (2021). Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature. Applied Sciences, 11(19), 8844. https://doi.org/10.3390/app11198844