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Journal: Appl. Sci., 2021
Volume: 11
Number: 5663
5663
Article: Investigation of the Thermal Conductivity of Silicon-Base Composites: The Effect of Filler Materials and Characteristic on Thermo-Mechanical Response of Silicon Composite
Authors: by Giacomo Riccucci, Lorenzo Pezzana, Simone Lantean, Alice Tori, Silvia Spriano and Marco Sangermano
Link: https://www.mdpi.com/2076-3417/11/12/5663

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