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Journal: Appl. Sci., 2020
Volume: 10
Number: 8935

Article: The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint
Authors: by Peng Xue, Jianzhi Tao, Peng He, Weimin Long and Sujuan Zhong
Link: https://www.mdpi.com/2076-3417/10/24/8935

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