Order Article Reprints
Journal: Appl. Sci., 2020
Volume: 10
Number: 8935
Article:
The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint
Authors:
by
Peng Xue, Jianzhi Tao, Peng He, Weimin Long and Sujuan Zhong
Link:
https://www.mdpi.com/2076-3417/10/24/8935
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.