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Journal: Appl. Sci., 2020
Volume: 10
Number: 4202

Article: Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials
Authors: by Mou Xu, Yu-Feng Chen, Jian-Yang Liang, Dong-Chuan Mo and Shu-Shen Lyu
Link: https://www.mdpi.com/2076-3417/10/12/4202

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