Xu, M.; Chen, Y.-F.; Liang, J.-Y.; Mo, D.-C.; Lyu, S.-S.
Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials. Appl. Sci. 2020, 10, 4202.
https://doi.org/10.3390/app10124202
AMA Style
Xu M, Chen Y-F, Liang J-Y, Mo D-C, Lyu S-S.
Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials. Applied Sciences. 2020; 10(12):4202.
https://doi.org/10.3390/app10124202
Chicago/Turabian Style
Xu, Mou, Yu-Feng Chen, Jian-Yang Liang, Dong-Chuan Mo, and Shu-Shen Lyu.
2020. "Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials" Applied Sciences 10, no. 12: 4202.
https://doi.org/10.3390/app10124202
APA Style
Xu, M., Chen, Y.-F., Liang, J.-Y., Mo, D.-C., & Lyu, S.-S.
(2020). Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials. Applied Sciences, 10(12), 4202.
https://doi.org/10.3390/app10124202