Cooling Behavior and Microstructure of Semisolid A201 Aluminum Alloy Prepared by the SEED Process
Abstract
:1. Introduction
2. Materials and Methods
2.1. Material and Thermodynamic Analyses
2.2. Slurry Preparation and Temperature Data Collection
2.3. Microstrucutral Observations
2.4. Modification of the SEED Process
3. Results and Discussion
3.1. Process Window of A201 Alloy
3.2. Cooling Behavior of the Slurry duing the SEED Process
3.3. Effects of Pouring Temperature on Semisolid Microstructure
3.4. Effects of Processing Time on Semisolid Microstrutures
3.5. Cooling Behavior and Microstructures in the Modified SEED Process
3.6. Microstructure Formation Mechanism of the SEED Process
4. Conclusions
Author Contributions
Funding
Acknowledgments
Conflicts of Interest
References
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Alloy | Cu | Mg | Ag | Si | Fe | Ti | Mn | Al |
---|---|---|---|---|---|---|---|---|
A201 | 4.0–5.2 | 0.15–0.55 | 0.4–1.0 | <0.1 | <0.15 | 0.15–0.35 | 0.20–0.50 | Bal. |
This study | 4.8 | 0.25 | 0.56 | 0.09 | 0.15 | 0.25 | 0.29 | Bal. |
Cooling Rate (K/min) | Solidification Interval (°C) | Temperature Window (°C) | Temperature Sensitivity | Time Window (s) |
---|---|---|---|---|
1 | 115.6 | 14.2 | 0.014 | 852 |
5 | 117.3 | 14.0 | 0.014 | 168 |
10 | 121.8 | 13.7 | 0.017 | 70.2 |
15 | 122.4 | 14.1 | 0.014 | 56.4 |
Equilibrium | 104.8 | 10.7 | 0.019 | / |
Scheil model | 146.0 | 11.9 | 0.017 | / |
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Gao, J.; Hu, X.; Zhu, Q.; Li, D.; Kang, Y. Cooling Behavior and Microstructure of Semisolid A201 Aluminum Alloy Prepared by the SEED Process. Metals 2019, 9, 922. https://doi.org/10.3390/met9090922
Gao J, Hu X, Zhu Q, Li D, Kang Y. Cooling Behavior and Microstructure of Semisolid A201 Aluminum Alloy Prepared by the SEED Process. Metals. 2019; 9(9):922. https://doi.org/10.3390/met9090922
Chicago/Turabian StyleGao, Junzhen, Xiaogang Hu, Qiang Zhu, Daquan Li, and Yonglin Kang. 2019. "Cooling Behavior and Microstructure of Semisolid A201 Aluminum Alloy Prepared by the SEED Process" Metals 9, no. 9: 922. https://doi.org/10.3390/met9090922