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Journal: Metals, 2018
Volume: 8
Number: 586

Article: Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
Authors: by Junghwan Bang, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa and Chang-Woo Lee
Link: https://www.mdpi.com/2075-4701/8/8/586

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