Bang, J.; Yu, D.-Y.; Yang, M.; Ko, Y.-H.; Yoon, J.-W.; Nishikawa, H.; Lee, C.-W.
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition. Metals 2018, 8, 586.
https://doi.org/10.3390/met8080586
AMA Style
Bang J, Yu D-Y, Yang M, Ko Y-H, Yoon J-W, Nishikawa H, Lee C-W.
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition. Metals. 2018; 8(8):586.
https://doi.org/10.3390/met8080586
Chicago/Turabian Style
Bang, Junghwan, Dong-Yurl Yu, Ming Yang, Yong-Ho Ko, Jeong-Won Yoon, Hiroshi Nishikawa, and Chang-Woo Lee.
2018. "Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition" Metals 8, no. 8: 586.
https://doi.org/10.3390/met8080586
APA Style
Bang, J., Yu, D.-Y., Yang, M., Ko, Y.-H., Yoon, J.-W., Nishikawa, H., & Lee, C.-W.
(2018). Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition. Metals, 8(8), 586.
https://doi.org/10.3390/met8080586