Ilie, A.-A.; Niculescu, F.; Iacob, G.; Pencea, I.; Miculescu, F.; Bololoi, R.; Drăguț, D.-V.; Matei, A.-C.; Ghiţă, M.; Priceputu, A.;
et al. Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications. Metals 2025, 15, 915.
https://doi.org/10.3390/met15080915
AMA Style
Ilie A-A, Niculescu F, Iacob G, Pencea I, Miculescu F, Bololoi R, Drăguț D-V, Matei A-C, Ghiţă M, Priceputu A,
et al. Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications. Metals. 2025; 15(8):915.
https://doi.org/10.3390/met15080915
Chicago/Turabian Style
Ilie, Andrei-Alexandru, Florentina Niculescu, Gheorghe Iacob, Ion Pencea, Florin Miculescu, Robert Bololoi, Dumitru-Valentin Drăguț, Alexandru-Cristian Matei, Mihai Ghiţă, Adrian Priceputu,
and et al. 2025. "Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications" Metals 15, no. 8: 915.
https://doi.org/10.3390/met15080915
APA Style
Ilie, A.-A., Niculescu, F., Iacob, G., Pencea, I., Miculescu, F., Bololoi, R., Drăguț, D.-V., Matei, A.-C., Ghiţă, M., Priceputu, A., & Ungureanu, C.
(2025). Microstructure and Properties of Bi-Sn, Bi-Sn-Sb, and Bi-Sn-Ag Solder Alloys for Electronic Applications. Metals, 15(8), 915.
https://doi.org/10.3390/met15080915
