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Journal: Metals, 2024
Volume: 14
Number: 453

Article: Investigating the Thermal Conductance of the Cu/Si Interface Using the Molecular Dynamics Method
Authors: by Shuai Liu, Yueyi Zhi, Hongquan Song, Huijin Li, Weiping Wang, Xiaoyan Hu and Dongbo Zhang
Link: https://www.mdpi.com/2075-4701/14/4/453

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