Next Article in Journal
Effects of Powder Characteristics and Chemical Composition on the Properties of 25Cr7Ni Stainless Steel Fabricated by Laser-Powder Bed Fusion and Evaluation of Process Simulation
Previous Article in Journal
Microstructures and Electrical Resistivity of Aluminum–Copper Joints
Previous Article in Special Issue
A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder
 
 

Order Article Reprints

Journal: Metals, 2023
Volume: 13
Number: 1475

Article: Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties
Authors: by Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang and Weiming Chen
Link: https://www.mdpi.com/2075-4701/13/8/1475

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop