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Journal: Metals, 2023
Volume: 13
Number: 1475
Article:
Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties
Authors:
by
Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang and Weiming Chen
Link:
https://www.mdpi.com/2075-4701/13/8/1475
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