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Journal: Metals, 2023
Volume: 13
Number: 1145
1145
Article: Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach
Authors: by Nguyen Thi Hong Hoa, Nguyen To Hoan, Nghia Nguyen Trong, Nguyen Thi Ngoc Linh, Bui Minh Quy, Thi Thu Ha Pham, Van Que Nguyen, Phuoc Nguyen Van and Vinh Dinh Nguyen
Link: https://www.mdpi.com/2075-4701/13/6/1145

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