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Journal: Metals, 2023
Volume: 13
Number: 1747

Article: Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias
Authors: by Devi Indrawati Syafei, Meng-Ting Chiang and Tung-Han Chuang
Link: https://www.mdpi.com/2075-4701/13/10/1747

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