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Journal: Metals, 2021
Volume: 11
Number: 1065

Article: Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling
Authors: by Chun-Chieh Mo, Dinh-Phuc Tran, Jing-Ye Juang and Chih Chen
Link: https://www.mdpi.com/2075-4701/11/7/1065

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