Order Article Reprints

Peng YZ, Li CJ, Yang JJ, Zhang JT, Peng JB, Zhou GJ, Pu CJ, Yi JH. Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders. Metals. 2021; 11(4):538. https://doi.org/10.3390/met11040538

Peng, Yan Zhi, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu, and Jian Hong Yi. 2021. "Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders" Metals 11, no. 4: 538. https://doi.org/10.3390/met11040538

Peng, Y. Z., Li, C. J., Yang, J. J., Zhang, J. T., Peng, J. B., Zhou, G. J., Pu, C. J., & Yi, J. H. (2021). Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders. Metals, 11(4), 538. https://doi.org/10.3390/met11040538