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Journal: Metals, 2021
Volume: 11
Number: 460
Article:
Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps
Authors:
by
Yeong-Maw Hwang, Cheng-Tang Pan, Bo-Syun Chen and Sheng-Rui Jian
Link:
https://www.mdpi.com/2075-4701/11/3/460
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