Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging
In the field of electronics packaging, Pb-bearing solder alloys are mostly used as robust interconnecting materials [...] View Full-Text
Ahn, B. Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging. Metals 2021, 11, 1941. https://doi.org/10.3390/met11121941
Ahn B. Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging. Metals. 2021; 11(12):1941. https://doi.org/10.3390/met11121941
Chicago/Turabian StyleAhn, Byungmin. 2021. "Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging" Metals 11, no. 12: 1941. https://doi.org/10.3390/met11121941