Next Article in Journal
Study of the Effect of a Plug with Torsion Channels on the Mixing Time in a Continuous Casting Ladle Water Model
Previous Article in Journal
Effect of Cryogenic Treatment on Microstructure, Mechanical Properties and Distortion of Carburized Gear Steels
Previous Article in Special Issue
Recent Advances in Brazing Fillers for Joining of Dissimilar Materials
 
 
Editorial

Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

by 1,2
1
Department of Materials Science and Engineering, Ajou University, Suwon 16499, Korea
2
Department of Energy Systems Research, Ajou University, Suwon 16499, Korea
Metals 2021, 11(12), 1941; https://doi.org/10.3390/met11121941
Received: 15 November 2021 / Accepted: 19 November 2021 / Published: 1 December 2021
Note: In lieu of an abstract, this is an excerpt from the first page.

In the field of electronics packaging, Pb-bearing solder alloys are mostly used as robust interconnecting materials [...] View Full-Text
MDPI and ACS Style

Ahn, B. Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging. Metals 2021, 11, 1941. https://doi.org/10.3390/met11121941

AMA Style

Ahn B. Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging. Metals. 2021; 11(12):1941. https://doi.org/10.3390/met11121941

Chicago/Turabian Style

Ahn, Byungmin. 2021. "Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging" Metals 11, no. 12: 1941. https://doi.org/10.3390/met11121941

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop