Next Article in Journal
Effect of B2O3 on the Sintering Process of Vanadium–Titanium Magnet Concentrates and Hematite
Next Article in Special Issue
Microstructure and Performance Analysis of Welded Joint of Spray-Deposited 2195 Al-Cu-Li Alloy Using GTAW
Previous Article in Journal
Dilution Ratio and the Resulting Composition Profile in Dissimilar Laser Powder Bed Fusion of AlSi10Mg and Al99.8
Previous Article in Special Issue
Electrochemical Migration Inhibition of Tin by Disodium Hydrogen Phosphate in Water Drop Test
 
 

Order Article Reprints

Journal: Metals, 2020
Volume: 10
Number: 1223

Article: Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices
Authors: by Guoqian Mu, Wenqing Qu, Haiyun Zhu, Hongshou Zhuang and Yanhua Zhang
Link: https://www.mdpi.com/2075-4701/10/9/1223

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop