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Journal: Metals, 2020
Volume: 10
Number: 160
Article:
Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn–Al–Mg Solder
Authors:
by
Roman Kolenak, Igor Kostolny, Jaromir Drapala, Paulina Zackova and Marcel Kuruc
Link:
https://www.mdpi.com/2075-4701/10/2/160
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