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Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

1
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
2
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
3
Institute of Advanced Brazing Materials and Technology, China Innovation Academy of Intelligent Equipment Co., Ltd., Ningbo 315700, China
*
Author to whom correspondence should be addressed.
Metals 2020, 10(10), 1373; https://doi.org/10.3390/met10101373
Received: 27 September 2020 / Revised: 12 October 2020 / Accepted: 13 October 2020 / Published: 15 October 2020
Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure evolution on the interface of Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joints, as well as the effects of extreme thermal shock on mechanical properties and the fracture mode in the course of extreme thermal changes between −196 and 150 °C, have been investigated. Results revealed that the interface layers comprised of two thin layers of NiGe and Ni5Ge3 compounds after Au-12Ge solder alloy was soldered on the Au/Ni/Cu substrate. After extreme thermal shock tests, the microstructure morphology converted from scallop type to planar one due to the translation from NiGe to Ni5Ge3. Meanwhile, the thickness of interface layer hardly changed. The shear strength of the joints after 300 cycles of extreme thermal shock was 35.1 MPa, which decreased by 19.61%. The fracture location changed from the solder to solder/NiGe interface, and then to the interface of NiGe/Ni5Ge3 IMC layer. Moreover, the fracture type of the joints gradually transformed from ductile fracture mode to brittle mode during thermal shock test. Simultaneously, the formation and extension of defects, such as micro-voids and micro-cracks, were found during the process of thermal shock due to the different thermal expansion coefficient among the solder, interface layer and substrate. View Full-Text
Keywords: Au-12Ge solder joint; extreme thermal shock; microstructure; mechanical properties; fracture behavior Au-12Ge solder joint; extreme thermal shock; microstructure; mechanical properties; fracture behavior
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Wang, Z.; Xue, S.; Long, W.; Wang, B.; Wang, J.; Zhang, P. Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint. Metals 2020, 10, 1373.

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