Digital Twins, AI, and Cybersecurity in Additive Manufacturing: A Comprehensive Review of Current Trends and Challenges
Abstract
1. Introduction
2. Digital Twin Technology in Additive Manufacturing
3. Modular AI for System Reconfiguration and Optimization (AI/ML Algorithms)
4. Cyber Security in Additive Manufacturing
- STL or G-code file of the object produced in a lab environment.
- The audio signal was recorded during manufacturing.
- The audio fingerprint was calculated, encrypted, and appended to the G-code file.
5. Synergistic Integration of Digital Twins, AI, and Cybersecurity in Additive Manufacturing
5.1. Feedback-Driven Predictive Optimization
5.2. Adaptive Cybersecurity Through AI-Enhanced Monitoring
6. Challenges and Possible Solutions
6.1. Cybersecurity Vulnerabilities
6.2. Possible Solutions
- Shi et al. [95] proposed using side-channel data—such as acoustic signals and vibrations—in combination with AI-based anomaly detection to increase the accuracy of attack detection and hence support real-time monitoring operations.
- Blockchain technology is recommended for inclusion to create unalterable audit trails for important design files, including STL and G-code. Blockchain technology’s distributed ledger enables the verification of manufacturing operations’ legality by preventing unauthorized access and ensuring the authenticity of files throughout the production process [108,109].
- Developing advanced encryption techniques in conjunction with blockchain technology will help ensure the security of the transport and storage of design files and sensitive data.
6.2.1. AI-Driven System Reliability
- Regularly updating AI models with real-world data helps increase the accuracy of forecasts and flexibility in adapting to changing AM conditions.
- Using blockchain-based smart contracts can help AI become more dependable, as these contracts can automate model modifications and validate the integrity of training data. Haw et al. [110] and Westphal et al. [111] introduced a foundation of blockchain with a blockchain-based quality management system that ensures data traceability in AM. Lupi et al. [112] proposed a shared manufacturing approach leveraging blockchain for decentralized production validation. Additionally, Alkhader et al. [113] demonstrated a comprehensive framework for blockchain-enabled traceability and management in AM that reinforces the trustworthiness of AI-driven process improvements.
6.2.2. The Challenge in Combining Physical and Digital Systems
- Wang et al. [59] have proposed the application of modular AI frameworks that can adjust to unexpected environments, including material discrepancies.
- Traceability solutions by blockchain technology can closely track the whole production process, and this guarantees that the data obtained from sensors, DTs, and AI models is preserved in a safe manner and can be validated, therefore helping with system synchronization and the resolution of any potential errors [114,115,116,117,118,119].
6.2.3. High Costs and Resource Requirements
- Use cloud-based systems to lower starting costs and enable less privileged people to access highly performing technologies. Simeone et al. [124] focused on improving resource efficiency in additive manufacturing services via introducing a smart cloud manufacturing platform. Later on, Rahman et al. [125] proposed a cloud-based cyber-physical system that provides advanced manufacturing capabilities. Furthermore, Haghnegahdar et al. [126] highlighted the critical role of industrial IoT-based cloud approaches in democratizing intelligent additive manufacturing.
- Promote the creation of blockchain-based cooperative networks that enable small and medium-sized businesses to exchange resources and access verified manufacturing data, thereby reducing the cost of individual investments. Shared additive manufacturing model [112], blockchain integration with supply chain [119], and cognitive analytics framework [127] contribute to sustainability and resilience in e-commerce-driven additive manufacturing supply chains.
6.3. Shortcomings and Proposed Framework
6.3.1. Framework Overview and Architecture
6.3.2. Digital Twin Layer: Real-Time Process Replication and Simulation
- Real-time checking of in-process abnormalities (e.g., overheating, delamination, recoater failures),
- Predictive simulations handling finite element or reduced-order simulations for thermal and residual stress inference,
- Control validation by evaluating expected results against live sensor feedback.
6.3.3. AI Layer: Data-Driven Intelligence and Control Optimization
- Physics-Informed Neural Networks (PINNs) for explaining inverse problems such as rebuilding indefinite boundary conditions from partial thermal data [133].
- Deep learning models (e.g., CNNs, LSTMs) trained on prior process data to estimate defect formation, porosity zones, or layer-wise quality differences [134].
- Reinforcement Learning (RL) drivers learn to independently adjust laser power, scan speed, or hatch spaces in real time to enhance process results [135].
6.3.4. Blockchain Layer: Secure Traceability, IP Management, and Smart Contracts
- Generates a tamper-proof audit trail for build records, parameter changes, and failure events [136].
- Implements access control using smart contracts to guarantee only authorized personnel or collaborators can view/edit critical data [137].
- Enables IP protection by combining design files, toolpaths, and quality metrics to unique blockchain logs, preventing unauthorized access or modifications.
6.3.5. Middleware Orchestration: Real-Time Integration and Interoperability
- Event-driven interaction, allowing data triggers (e.g., thermal anomaly detection) to use blockchain transactions or AI-based control updates,
- Standardized data formats and ontologies for inferring sensor feedback, simulation outputs, and blockchain metadata throughout subsystems,
- APIs and microservices for integrating external systems, such as PLM systems, ERP tools, or connected manufacturing networks.
6.3.6. Implementation Cost Considerations
7. Conclusions
- This paper summarizes and critically analyzes multiple data-driven (DT) architectures for additive manufacturing (AM), including mechanical, control, and machine learning-based models, and discusses their role in in situ monitoring and process optimization.
- This paper reviews the role of dynamic and modular AI frameworks, including PINNs, CNNs, LSTMs, and RL algorithms, in adjusting real-time AM process parameters, such as laser power and scan speed, to optimize build quality.
- The paper proposes a holistic closed-loop architecture that combines a Digital Twin, AI, a blockchain network, and real-time middleware orchestration to enable intelligent control, predictive process optimization, and secure cyber-physical interaction in additive manufacturing (AM) production systems.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Reference | Contributions | Future Scope |
---|---|---|
[15] |
| A single in situ sensor monitors only temperature distribution but additional process parameters such as laser power, scan speed, layer thickness etc., can extend the accuracy of flaw detection across various AM methods |
[17] |
| Advanced AI and ML Integration with cyber-physical systems can improve real-time data analytics capabilities to facilitate predictive insights |
[16] |
| The DT-enabled collaborative data management system can have ML-enabled advanced data analytics developed and implemented and applied in it |
[40] |
| Implementing predictive models that can adapt in real time to changing conditions during the AM process is a significant challenge. It needs more validation and a verification process |
[41] |
| The development of a comprehensive database and quantitative study of solidification texture can be explored |
[20] |
| Enhanced data integration and open-source collaboration can improve the DT applications in AM |
[42] |
| To improve the AM process chain, it is crucial to guarantee the validity and verifiability of the possible basic self-learning strategies as well as to better control data |
Reference | AI Model | Contribution in AM (What They Did and What Are the Results) |
---|---|---|
[58] | ANN | AI into AM, leading to the development of closed-loop AM systems and DTs |
[59] | Deep learning | A smart AM framework based on cloud-edge computing |
[60] | ML | an innovative approach for online quality monitoring of AM employing acoustic emissions |
[61] | AI | The osmotic manufacturing method was proposed as a concept to apply additive manufacturing techniques together with graph theory |
[62] | Deep learning | A real-time computing-based self-monitoring system has been designed to classify the several degrees of delamination that could arise in a printed part |
[63] | ML and Deep learning | An overview of AI in AM for a closed-loop system is presented |
[64] | AI | Shows how artificial intelligence may increase design efficiency, help discover materials, maximize additive manufacturing techniques, and guarantee the quality of outputs generated by AM |
[65] | A generalizable AI | A fully automated workflow across several AM systems should be used for the aim of supporting quick autonomous process parameter discovery and/or enhanced scientific understanding |
[66] | AI | It speeds up simulations, improves the selection of materials, facilitates the design of novel structures with multiple functionalities, and cuts down on both time and money spending |
Major Attacks | Subcategory Attack | Attack Model | Existing Solutions | References |
---|---|---|---|---|
Hardware Attacks | Side channel attacks | Acoustic Analysis, Electromagnetic Attacks, Power Analysis, Data Residuals, Environmental Exploits, Trimming Exploits, Cache Side-Channel, Differential Faults |
| [79,80,81,82,83,84,85,86,87,88,89,90,91] |
Physical attacks | Physical Damage, Chip Decapsulation, Node Jamming, Node Tampering, Fake Node Injection, Code Injection, Sleep Deprivation Attack RF Interference | |||
Network attacks | Outage attacks, DoS, tag cloning, camouflage, Man in the Middle, micro probing, traffic analysis, object replication | |||
Data Attacks | Data exposure, leakage, loss, and scavenging; account hijacking; brute force; hash collision; malicious VM (virtual machine); and VM hopping | |||
Software Attacks | Firmware attacks | Malware, reverse engineering, control hijacking, eavesdropping | ||
Operating system attacks | Malware, worm, virus, Trojan, phishing, brute force, back door | |||
Web application attacks | Malware, spyware, DDoS, pathbased DoS, reprogram attacks, malicious code injection, exploitation for reconfiguration |
Reference | Attack Type | Detection Method | Result |
---|---|---|---|
[92] | Malicious void Consequence | The effect on the mechanical strength of a printed specimen was investigated by means of a “printed void” | 14% reduction in yield load |
[93] | Dimensions Change | Developed the Bayesian game, computing Bayes–Nash equilibria | Operators under attack were not aware of dimensional change without reminding |
[94] | Printing orientation | Mechanical testing, finite element analysis, and ultrasonic inspection | Strength, failure strain reduction |
[78] | Malicious void Consequence | Presented DTs utilizing data-driven ML models, and physics-based models | Drone propeller fatigue life reduction |
[95] | Inside the hole of a solid block |
|
|
[82] | Different infill defect patterns | RNN, Random Forest, and anomaly detection | The accuracy of anomaly detection is 96.6% |
[96] | Alternation of G code | Audio fingerprint comparison | The detection rate of the deviation at the time of its occurrence was 100% |
[97] | Vulnerability in critical components named Gear and Wrench | ML Model | Proposed robust detection systems to prevent structural failures |
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Ahmmed, M.S.; Khan, L.; Mahmood, M.A.; Liou, F. Digital Twins, AI, and Cybersecurity in Additive Manufacturing: A Comprehensive Review of Current Trends and Challenges. Machines 2025, 13, 691. https://doi.org/10.3390/machines13080691
Ahmmed MS, Khan L, Mahmood MA, Liou F. Digital Twins, AI, and Cybersecurity in Additive Manufacturing: A Comprehensive Review of Current Trends and Challenges. Machines. 2025; 13(8):691. https://doi.org/10.3390/machines13080691
Chicago/Turabian StyleAhmmed, Md Sazol, Laraib Khan, Muhammad Arif Mahmood, and Frank Liou. 2025. "Digital Twins, AI, and Cybersecurity in Additive Manufacturing: A Comprehensive Review of Current Trends and Challenges" Machines 13, no. 8: 691. https://doi.org/10.3390/machines13080691
APA StyleAhmmed, M. S., Khan, L., Mahmood, M. A., & Liou, F. (2025). Digital Twins, AI, and Cybersecurity in Additive Manufacturing: A Comprehensive Review of Current Trends and Challenges. Machines, 13(8), 691. https://doi.org/10.3390/machines13080691